Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

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Original language	English
Pages (from-to)	1115-1122
Number of pages	0
Journal	Journal of Electronic Materials
Volume	34
Issue number	8
DOIs	https://doi.org/10.1007/s11664-005-0239-6
Publication status	Published - Aug 2005

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@article{d5722d880c9349b2a389cdb953b310fd,

title = "Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates",

author = "Rizvi, \{M. J.\} and Chan, \{Y. C.\} and C. Bailey and H. Lu and Islam, \{M. N.\} and Wu, \{B. Y.\}",

year = "2005",

month = aug,

doi = "10.1007/s11664-005-0239-6",

language = "English",

volume = "34",

pages = "1115--1122",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "8",

}

TY - JOUR

T1 - Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

AU - Rizvi, M. J.

AU - Chan, Y. C.

AU - Bailey, C.

AU - Lu, H.

AU - Islam, M. N.

AU - Wu, B. Y.

PY - 2005/8

Y1 - 2005/8

U2 - 10.1007/s11664-005-0239-6

DO - 10.1007/s11664-005-0239-6

M3 - Article

SN - 0361-5235

VL - 34

SP - 1115

EP - 1122

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 8

ER -