Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

M. J. Rizvi^*, Y. C. Chan, C. Bailey, H. Lu, M. N. Islam, B. Y. Wu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1115-1122
Number of pages	0
Journal	Journal of Electronic Materials
Volume	34
Issue number	8
DOIs	https://doi.org/10.1007/s11664-005-0239-6
Publication status	Published - Aug 2005

Access to Document

@article{d5722d880c9349b2a389cdb953b310fd,

title = "Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates",

author = "Rizvi, {M. J.} and Chan, {Y. C.} and C. Bailey and H. Lu and Islam, {M. N.} and Wu, {B. Y.}",

year = "2005",

month = aug,

doi = "10.1007/s11664-005-0239-6",

language = "English",

volume = "34",

pages = "1115--1122",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "8",

}

TY - JOUR

T1 - Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

AU - Rizvi, M. J.

AU - Chan, Y. C.

AU - Bailey, C.

AU - Lu, H.

AU - Islam, M. N.

AU - Wu, B. Y.

PY - 2005/8

Y1 - 2005/8

U2 - 10.1007/s11664-005-0239-6

DO - 10.1007/s11664-005-0239-6

M3 - Article

SN - 0361-5235

VL - 34

SP - 1115

EP - 1122

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 8

ER -