Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2006 1st Electronic Systemintegration Technology Conference
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/estc.2006.280134
Publication status	Published - 2006
Event	2006 1st Electronic Systemintegration Technology Conference - Duration: 5 Sept 2006 → 7 Sept 2006

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@article{2b8b3446360c413795f5d786f7b3314b,

title = "Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow",

author = "Yin, \{C. Y.\} and Rizvi, \{M. J.\} and H. Lu and C. Bailey",

year = "2006",

doi = "10.1109/estc.2006.280134",

language = "English",

volume = "0",

journal = "2006 1st Electronic Systemintegration Technology Conference",

number = "0",

note = "2006 1st Electronic Systemintegration Technology Conference ; Conference date: 05-09-2006 Through 07-09-2006",

}

TY - JOUR

T1 - Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow

AU - Yin, C. Y.

AU - Rizvi, M. J.

AU - Lu, H.

AU - Bailey, C.

PY - 2006

Y1 - 2006

U2 - 10.1109/estc.2006.280134

DO - 10.1109/estc.2006.280134

M3 - Conference proceedings published in a journal

VL - 0

JO - 2006 1st Electronic Systemintegration Technology Conference

JF - 2006 1st Electronic Systemintegration Technology Conference

IS - 0

T2 - 2006 1st Electronic Systemintegration Technology Conference

Y2 - 5 September 2006 through 7 September 2006

ER -