Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow

C. Y. Yin, M. J. Rizvi, H. Lu, C. Bailey

Research output: Contribution to journalConference proceedings published in a journalpeer-review

Original languageEnglish
Number of pages0
Journal2006 1st Electronic Systemintegration Technology Conference
Volume0
Issue number0
DOIs
Publication statusPublished - 2006
Event2006 1st Electronic Systemintegration Technology Conference -
Duration: 5 Sept 20067 Sept 2006

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