Original language | English |
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Number of pages | 0 |
Journal | 2006 1st Electronic Systemintegration Technology Conference |
Volume | 0 |
Issue number | 0 |
DOIs | |
Publication status | Published - 2006 |
Event | 2006 1st Electronic Systemintegration Technology Conference - Duration: 5 Sept 2006 → 7 Sept 2006 |
Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow
C. Y. Yin, M. J. Rizvi, H. Lu, C. Bailey
Research output: Contribution to journal › Conference proceedings published in a journal › peer-review