Study of anisotropic conductive adhesive joint behavior under 3-point bending

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	589-596
Number of pages	0
Journal	Microelectronics Reliability
Volume	45
Issue number	0
DOIs	https://doi.org/10.1016/j.microrel.2004.10.015
Publication status	Published - Mar 2005

Access to Document

@article{f71f11b84a5741058532b08e3b48a819,

title = "Study of anisotropic conductive adhesive joint behavior under 3-point bending",

author = "Rizvi, \{M. J.\} and Chan, \{Y. C.\} and C. Bailey and H. Lu",

year = "2005",

month = mar,

doi = "10.1016/j.microrel.2004.10.015",

language = "English",

volume = "45",

pages = "589--596",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd.",

number = "0",

}

TY - JOUR

T1 - Study of anisotropic conductive adhesive joint behavior under 3-point bending

AU - Rizvi, M. J.

AU - Chan, Y. C.

AU - Bailey, C.

AU - Lu, H.

PY - 2005/3

Y1 - 2005/3

U2 - 10.1016/j.microrel.2004.10.015

DO - 10.1016/j.microrel.2004.10.015

M3 - Article

SN - 0026-2714

VL - 45

SP - 589

EP - 596

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 0

ER -