Study of anisotropic conductive adhesive joint behavior under 3-point bending

M. J. Rizvi, Y. C. Chan^*, C. Bailey, H. Lu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	589-596
Number of pages	0
Journal	Microelectronics Reliability
Volume	45
Issue number	0
DOIs	https://doi.org/10.1016/j.microrel.2004.10.015
Publication status	Published - Mar 2005

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title = "Study of anisotropic conductive adhesive joint behavior under 3-point bending",

author = "Rizvi, {M. J.} and Chan, {Y. C.} and C. Bailey and H. Lu",

year = "2005",

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T1 - Study of anisotropic conductive adhesive joint behavior under 3-point bending

AU - Rizvi, M. J.

AU - Chan, Y. C.

AU - Bailey, C.

AU - Lu, H.

PY - 2005/3

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U2 - 10.1016/j.microrel.2004.10.015

DO - 10.1016/j.microrel.2004.10.015

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VL - 45

SP - 589

EP - 596

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 0

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