Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor

Xiaodong Hu; P. MacKowiak; Yucheng Zhang; Oswin Ehrmann; Klaus Dieter Lang; Martin Schneider-Ramelow; Ulli Hansen; Simon Maus; Oliver Gyenge; Maozhou Meng; Ha Duong Ngo

doi:10.1109/eptc.2017.8277550

Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor

Xiaodong Hu^*
, P. MacKowiak
, Yucheng Zhang
, Oswin Ehrmann
, Klaus Dieter Lang
, Martin Schneider-Ramelow
, Ulli Hansen
, Simon Maus
, Oliver Gyenge
, Maozhou Meng
, Ha Duong Ngo

^*Corresponding author for this work

School of Engineering, Computing and Mathematics

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/eptc.2017.8277550
Publication status	Published - Dec 2017
Event	2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Duration: 6 Dec 2017 → 9 Dec 2017

Access to Document

10.1109/eptc.2017.8277550

Cite this

@article{7d8d60ddb0fd4b8d936d407ded1f3c0f,

title = "Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor",

author = "Xiaodong Hu and P. MacKowiak and Yucheng Zhang and Oswin Ehrmann and Lang, \{Klaus Dieter\} and Martin Schneider-Ramelow and Ulli Hansen and Simon Maus and Oliver Gyenge and Maozhou Meng and Ngo, \{Ha Duong\}",

year = "2017",

month = dec,

doi = "10.1109/eptc.2017.8277550",

language = "English",

volume = "0",

journal = "2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)",

number = "0",

note = "2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ; Conference date: 06-12-2017 Through 09-12-2017",

}

TY - JOUR

T1 - Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor

AU - Hu, Xiaodong

AU - MacKowiak, P.

AU - Zhang, Yucheng

AU - Ehrmann, Oswin

AU - Lang, Klaus Dieter

AU - Schneider-Ramelow, Martin

AU - Hansen, Ulli

AU - Maus, Simon

AU - Gyenge, Oliver

AU - Meng, Maozhou

AU - Ngo, Ha Duong

PY - 2017/12

Y1 - 2017/12

U2 - 10.1109/eptc.2017.8277550

DO - 10.1109/eptc.2017.8277550

M3 - Conference proceedings published in a journal

VL - 0

JO - 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

JF - 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

IS - 0

T2 - 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Y2 - 6 December 2017 through 9 December 2017

ER -