Multiscale concurrent topology optimization of transient thermoelastic structures

Previous multiscale concurrent topology optimization methods for thermoelastic structures were primarily based on static loading and steady-state heat transfer conditions, which do not account for transient effects associated with time-dependent loads. To address this limitation, this paper establishes a novel generic multiscale concurrent topology optimization method that incorporates transient thermoelastic coupling based on transient heat conduction and structural dynamics. In this study, first, a transient multiscale thermoelastic sensitivity equation is innovatively derived through adjoint sensitivity analysis. The effectiveness of this equation is then demonstrated through comparative cases involving transient heat conduction, structural dynamics, and transient thermoelastic (including multimaterial and 3D problems) optimization. Furthermore, the research finds that the topology optimization of transient thermoelastic structures also presents transient effects at microscale. This method demonstrates good versatility and applicability across various optimization cases. The method has great potential in the integrated design of materials and structures involving coupling between time-dependent thermal loads and time-dependent mechanical loads.