Modeling the Effect of Lead-free Soldering on Flexible Substrates

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2006 International Conference on Electronic Materials and Packaging
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/emap.2006.4430695
Publication status	Published - Dec 2006
Event	2006 International Conference on Electronic Materials and Packaging - Duration: 11 Dec 2006 → 14 Dec 2006

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@article{805902dd72344f4d8f63084f0bf22686,

title = "Modeling the Effect of Lead-free Soldering on Flexible Substrates",

author = "Rizvi, \{M. J.\} and Yin, \{C. Y.\} and C. Bailey",

year = "2006",

month = dec,

doi = "10.1109/emap.2006.4430695",

language = "English",

volume = "0",

journal = "2006 International Conference on Electronic Materials and Packaging",

number = "0",

note = "2006 International Conference on Electronic Materials and Packaging ; Conference date: 11-12-2006 Through 14-12-2006",

}

TY - JOUR

T1 - Modeling the Effect of Lead-free Soldering on Flexible Substrates

AU - Rizvi, M. J.

AU - Yin, C. Y.

AU - Bailey, C.

PY - 2006/12

Y1 - 2006/12

U2 - 10.1109/emap.2006.4430695

DO - 10.1109/emap.2006.4430695

M3 - Conference proceedings published in a journal

VL - 0

JO - 2006 International Conference on Electronic Materials and Packaging

JF - 2006 International Conference on Electronic Materials and Packaging

IS - 0

T2 - 2006 International Conference on Electronic Materials and Packaging

Y2 - 11 December 2006 through 14 December 2006

ER -