Original language | English |
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Number of pages | 0 |
Journal | 2006 International Conference on Electronic Materials and Packaging |
Volume | 0 |
Issue number | 0 |
DOIs | |
Publication status | Published - Dec 2006 |
Event | 2006 International Conference on Electronic Materials and Packaging - Duration: 11 Dec 2006 → 14 Dec 2006 |
Modeling the Effect of Lead-free Soldering on Flexible Substrates
M. J. Rizvi, C. Y. Yin, C. Bailey
Research output: Contribution to journal › Conference proceedings published in a journal › peer-review