Modeling the Effect of Lead-free Soldering on Flexible Substrates

M. J. Rizvi, C. Y. Yin, C. Bailey

Research output: Contribution to journalConference proceedings published in a journalpeer-review

Original languageEnglish
Number of pages0
Journal2006 International Conference on Electronic Materials and Packaging
Volume0
Issue number0
DOIs
Publication statusPublished - Dec 2006
Event2006 International Conference on Electronic Materials and Packaging -
Duration: 11 Dec 200614 Dec 2006

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