Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

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Original language	English
Pages (from-to)	136-144
Number of pages	0
Journal	Journal of Alloys and Compounds
Volume	400
Issue number	0
DOIs	https://doi.org/10.1016/j.jallcom.2005.03.053
Publication status	Published - Sept 2005

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title = "Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder",

author = "Islam, \{M. N.\} and Chan, \{Y. C.\} and Rizvi, \{M. J.\} and W. Jillek",

year = "2005",

month = sep,

doi = "10.1016/j.jallcom.2005.03.053",

language = "English",

volume = "400",

pages = "136--144",

journal = "Journal of Alloys and Compounds",

issn = "0925-8388",

publisher = "Elsevier B.V.",

number = "0",

}

TY - JOUR

T1 - Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

AU - Islam, M. N.

AU - Chan, Y. C.

AU - Rizvi, M. J.

AU - Jillek, W.

PY - 2005/9

Y1 - 2005/9

U2 - 10.1016/j.jallcom.2005.03.053

DO - 10.1016/j.jallcom.2005.03.053

M3 - Article

SN - 0925-8388

VL - 400

SP - 136

EP - 144

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 0

ER -