Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design

Xiaodong Hu; Maozhou Meng; Manuel Baeuscher; Ulli Hansen; Simon Maus; Oliver Gyenge; Piotr Mackowiak; Biswajit Mukhopadhyay; N. Vokmer; Oswin Ehrmann; Lang K Dieter; Ha Duong Ngo

doi:10.1109/eptc.2016.7861498

Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design

Xiaodong Hu^*
, Maozhou Meng
, Manuel Baeuscher
, Ulli Hansen
, Simon Maus
, Oliver Gyenge
, Piotr Mackowiak
, Biswajit Mukhopadhyay
, N. Vokmer
, Oswin Ehrmann
, Lang K Dieter
, Ha Duong Ngo

^*Corresponding author for this work

School of Engineering, Computing and Mathematics

MSG Lithoglas GmbH
Technical University of Berlin
University of Derby
Fraunhofer Institute for Reliability and Microintegration
University of Applied Sciences Berlin

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/eptc.2016.7861498
Publication status	Published - Nov 2016
Event	2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Duration: 30 Nov 2016 → 3 Dec 2016

Access to Document

10.1109/eptc.2016.7861498

Cite this

Hu, X., Meng, M., Baeuscher, M., Hansen, U., Maus, S., Gyenge, O., Mackowiak, P., Mukhopadhyay, B., Vokmer, N., Ehrmann, O., Dieter, L. K., & Ngo, H. D. (2016). Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design. 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 0(0). https://doi.org/10.1109/eptc.2016.7861498

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title = "Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design",

author = "Xiaodong Hu and Maozhou Meng and Manuel Baeuscher and Ulli Hansen and Simon Maus and Oliver Gyenge and Piotr Mackowiak and Biswajit Mukhopadhyay and N. Vokmer and Oswin Ehrmann and Dieter, \{Lang K\} and Ngo, \{Ha Duong\}",

year = "2016",

month = nov,

doi = "10.1109/eptc.2016.7861498",

language = "English",

volume = "0",

journal = "2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)",

number = "0",

note = "2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) ; Conference date: 30-11-2016 Through 03-12-2016",

}

Hu, X, Meng, M, Baeuscher, M, Hansen, U, Maus, S, Gyenge, O, Mackowiak, P, Mukhopadhyay, B, Vokmer, N, Ehrmann, O, Dieter, LK & Ngo, HD 2016, 'Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design', 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), vol. 0, no. 0. https://doi.org/10.1109/eptc.2016.7861498

Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design. / Hu, Xiaodong; Meng, Maozhou; Baeuscher, Manuel et al.
In: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Vol. 0, No. 0, 11.2016.

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

TY - JOUR

T1 - Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design

AU - Hu, Xiaodong

AU - Meng, Maozhou

AU - Baeuscher, Manuel

AU - Hansen, Ulli

AU - Maus, Simon

AU - Gyenge, Oliver

AU - Mackowiak, Piotr

AU - Mukhopadhyay, Biswajit

AU - Vokmer, N.

AU - Ehrmann, Oswin

AU - Dieter, Lang K

AU - Ngo, Ha Duong

PY - 2016/11

Y1 - 2016/11

U2 - 10.1109/eptc.2016.7861498

DO - 10.1109/eptc.2016.7861498

M3 - Conference proceedings published in a journal

VL - 0

JO - 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

JF - 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

IS - 0

T2 - 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Y2 - 30 November 2016 through 3 December 2016

ER -