Impact of assembly process technologies on electronic packaging materials

T. Tilford*, C. Bailey, A. K. Parrott, J. Rizvi, C. Yin, K. I. Sinclair, M. P.Y. Desmulliez

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review

Fingerprint

Dive into the research topics of 'Impact of assembly process technologies on electronic packaging materials'. Together they form a unique fingerprint.

Engineering

Material Science