Finite element modelling of failures in thick film chip resistor solder joints

M. J. Rizvi; H. Lu; C. Bailey; E. Bevan; N. Pountney; J. Coates

doi:10.1109/impact.2010.5699488

Finite element modelling of failures in thick film chip resistor solder joints

M. J. Rizvi, H. Lu, C. Bailey, E. Bevan, N. Pountney, J. Coates

School of Engineering, Computing and Mathematics

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/impact.2010.5699488
Publication status	Published - Oct 2010
Event	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Duration: 20 Oct 2010 → 22 Oct 2010

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10.1109/impact.2010.5699488

Cite this

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title = "Finite element modelling of failures in thick film chip resistor solder joints",

author = "Rizvi, \{M. J.\} and H. Lu and C. Bailey and E. Bevan and N. Pountney and J. Coates",

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journal = "2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference",

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note = "2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ; Conference date: 20-10-2010 Through 22-10-2010",

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TY - JOUR

T1 - Finite element modelling of failures in thick film chip resistor solder joints

AU - Rizvi, M. J.

AU - Lu, H.

AU - Bailey, C.

AU - Bevan, E.

AU - Pountney, N.

AU - Coates, J.

PY - 2010/10

Y1 - 2010/10

U2 - 10.1109/impact.2010.5699488

DO - 10.1109/impact.2010.5699488

M3 - Conference proceedings published in a journal

VL - 0

JO - 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

JF - 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

IS - 0

T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Y2 - 20 October 2010 through 22 October 2010

ER -