Finite element modelling of failures in thick film chip resistor solder joints

M. J. Rizvi; H. Lu; C. Bailey; E. Bevan; N. Pountney; J. Coates

doi:10.1109/impact.2010.5699488

Finite element modelling of failures in thick film chip resistor solder joints

M. J. Rizvi
, H. Lu
, C. Bailey
, E. Bevan
, N. Pountney
, J. Coates

School of Engineering, Computing and Mathematics

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/impact.2010.5699488
Publication status	Published - Oct 2010
Event	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Duration: 20 Oct 2010 → 22 Oct 2010

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10.1109/impact.2010.5699488

Cite this

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title = "Finite element modelling of failures in thick film chip resistor solder joints",

author = "Rizvi, \{M. J.\} and H. Lu and C. Bailey and E. Bevan and N. Pountney and J. Coates",

year = "2010",

month = oct,

doi = "10.1109/impact.2010.5699488",

language = "English",

volume = "0",

journal = "2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference",

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note = "2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ; Conference date: 20-10-2010 Through 22-10-2010",

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TY - JOUR

T1 - Finite element modelling of failures in thick film chip resistor solder joints

AU - Rizvi, M. J.

AU - Lu, H.

AU - Bailey, C.

AU - Bevan, E.

AU - Pountney, N.

AU - Coates, J.

PY - 2010/10

Y1 - 2010/10

U2 - 10.1109/impact.2010.5699488

DO - 10.1109/impact.2010.5699488

M3 - Conference proceedings published in a journal

VL - 0

JO - 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

JF - 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

IS - 0

T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Y2 - 20 October 2010 through 22 October 2010

ER -