Original language | English |
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Number of pages | 0 |
Journal | 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference |
Volume | 0 |
Issue number | 0 |
DOIs | |
Publication status | Published - Oct 2010 |
Event | 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Duration: 20 Oct 2010 → 22 Oct 2010 |
Finite element modelling of failures in thick film chip resistor solder joints
M. J. Rizvi, H. Lu, C. Bailey, E. Bevan, N. Pountney, J. Coates
Research output: Contribution to journal › Conference proceedings published in a journal › peer-review