Finite element modelling of failures in thick film chip resistor solder joints

M. J. Rizvi, H. Lu, C. Bailey, E. Bevan, N. Pountney, J. Coates

Research output: Contribution to journalConference proceedings published in a journalpeer-review

Original languageEnglish
Number of pages0
Journal2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference
Volume0
Issue number0
DOIs
Publication statusPublished - Oct 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) -
Duration: 20 Oct 201022 Oct 2010

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