Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

M. J. Rizvi; C. Bailey; Y. C. Chan; H. Lu

doi:10.1109/itherm.2006.1645436

Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

M. J. Rizvi^*, C. Bailey, Y. C. Chan, H. Lu

^*Corresponding author for this work

School of Engineering, Computing and Mathematics

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/itherm.2006.1645436
Publication status	In preparation - 22 Dec 2006
Event	Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Duration: 3 Jan 0001 → …

Access to Document

10.1109/itherm.2006.1645436

Cite this

@article{169d06ad38d1457dba104c4c2ed683fe,

title = "Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films",

author = "Rizvi, {M. J.} and C. Bailey and Chan, {Y. C.} and H. Lu",

year = "2006",

month = dec,

day = "22",

doi = "10.1109/itherm.2006.1645436",

language = "English",

volume = "0",

journal = "Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.",

number = "0",

note = "Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ; Conference date: 03-01-0001",

}

Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. / Rizvi, M. J.; Bailey, C.; Chan, Y. C. et al.
In: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., Vol. 0, No. 0, 22.12.2006.

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

TY - JOUR

T1 - Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

AU - Rizvi, M. J.

AU - Bailey, C.

AU - Chan, Y. C.

AU - Lu, H.

PY - 2006/12/22

Y1 - 2006/12/22

U2 - 10.1109/itherm.2006.1645436

DO - 10.1109/itherm.2006.1645436

M3 - Conference proceedings published in a journal

VL - 0

JO - Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

JF - Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

IS - 0

T2 - Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

Y2 - 3 January 0001

ER -