Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

M. J. Rizvi; Y. C. Chan; C. Bailey; H. Lu; M. N. Islam

doi:10.1016/j.jallcom.2005.06.050

Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

M. J. Rizvi
, Y. C. Chan^*
, C. Bailey
, H. Lu
, M. N. Islam

^*Corresponding author for this work

School of Engineering, Computing and Mathematics

City University of Hong Kong
University of Greenwich

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	208-214
Number of pages	0
Journal	Journal of Alloys and Compounds
Volume	407
Issue number	0
DOIs	https://doi.org/10.1016/j.jallcom.2005.06.050
Publication status	Published - Jan 2006

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10.1016/j.jallcom.2005.06.050

Cite this

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title = "Effect of adding 1wt\% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging",

author = "Rizvi, \{M. J.\} and Chan, \{Y. C.\} and C. Bailey and H. Lu and Islam, \{M. N.\}",

year = "2006",

month = jan,

doi = "10.1016/j.jallcom.2005.06.050",

language = "English",

volume = "407",

pages = "208--214",

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AU - Rizvi, M. J.

AU - Chan, Y. C.

AU - Bailey, C.

AU - Lu, H.

AU - Islam, M. N.

PY - 2006/1

Y1 - 2006/1

U2 - 10.1016/j.jallcom.2005.06.050

DO - 10.1016/j.jallcom.2005.06.050

M3 - Article

SN - 0925-8388

VL - 407

SP - 208

EP - 214

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 0

ER -