Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder

M. J. Rizvi, C. Bailey^*, Y. C. Chan, H. Lu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	116-121
Number of pages	0
Journal	Journal of Alloys and Compounds
Volume	438
Issue number	0
DOIs	https://doi.org/10.1016/j.jallcom.2006.08.048
Publication status	Published - Jul 2007

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title = "Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder",

author = "Rizvi, {M. J.} and C. Bailey and Chan, {Y. C.} and H. Lu",

year = "2007",

month = jul,

doi = "10.1016/j.jallcom.2006.08.048",

language = "English",

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TY - JOUR

T1 - Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder

AU - Rizvi, M. J.

AU - Bailey, C.

AU - Chan, Y. C.

AU - Lu, H.

PY - 2007/7

Y1 - 2007/7

U2 - 10.1016/j.jallcom.2006.08.048

DO - 10.1016/j.jallcom.2006.08.048

M3 - Article

SN - 0925-8388

VL - 438

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EP - 121

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 0

ER -