Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

M. N. Islam, Y. C. Chan^*, A. Sharif, M. J. Rizvi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	217-223
Number of pages	0
Journal	Journal of Alloys and Compounds
Volume	396
Issue number	0
DOIs	https://doi.org/10.1016/j.jallcom.2005.01.001
Publication status	Published - Jun 2005

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title = "Effect of 9wt.\% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads",

author = "Islam, \{M. N.\} and Chan, \{Y. C.\} and A. Sharif and Rizvi, \{M. J.\}",

year = "2005",

month = jun,

doi = "10.1016/j.jallcom.2005.01.001",

language = "English",

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journal = "Journal of Alloys and Compounds",

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T1 - Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

AU - Islam, M. N.

AU - Chan, Y. C.

AU - Sharif, A.

AU - Rizvi, M. J.

PY - 2005/6

Y1 - 2005/6

U2 - 10.1016/j.jallcom.2005.01.001

DO - 10.1016/j.jallcom.2005.01.001

M3 - Article

SN - 0925-8388

VL - 396

SP - 217

EP - 223

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 0

ER -