Comparative Wetting Behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni Solders on Cu and Ni Substrates

M. J. Rizvi, C. Bailey^*, Y. C. Chan, H. Lu

^*Corresponding author for this work

Research output: Contribution to journal › Conference proceedings published in a journal › peer-review

Original language	English
Number of pages	0
Journal	2006 1st Electronic Systemintegration Technology Conference
Volume	0
Issue number	0
DOIs	https://doi.org/10.1109/estc.2006.279992
Publication status	Published - 2006
Event	2006 1st Electronic Systemintegration Technology Conference - Duration: 5 Sept 2006 → 7 Sept 2006

Access to Document

@article{0abeee76c7314579be8af1969aaacc69,

title = "Comparative Wetting Behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni Solders on Cu and Ni Substrates",

author = "Rizvi, {M. J.} and C. Bailey and Chan, {Y. C.} and H. Lu",

year = "2006",

doi = "10.1109/estc.2006.279992",

language = "English",

volume = "0",

journal = "2006 1st Electronic Systemintegration Technology Conference",

number = "0",

note = "2006 1st Electronic Systemintegration Technology Conference ; Conference date: 05-09-2006 Through 07-09-2006",

}

TY - JOUR

T1 - Comparative Wetting Behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni Solders on Cu and Ni Substrates

AU - Rizvi, M. J.

AU - Bailey, C.

AU - Chan, Y. C.

AU - Lu, H.

PY - 2006

Y1 - 2006

U2 - 10.1109/estc.2006.279992

DO - 10.1109/estc.2006.279992

M3 - Conference proceedings published in a journal

VL - 0

JO - 2006 1st Electronic Systemintegration Technology Conference

JF - 2006 1st Electronic Systemintegration Technology Conference

IS - 0

T2 - 2006 1st Electronic Systemintegration Technology Conference

Y2 - 5 September 2006 through 7 September 2006

ER -