Co-Design and multi-physics analysis for power electronic modules

C. Bailey; H. Lu; T. Tilford; J. Rizvi; C. Yin

doi:10.1109/ESIME.2009.4938505

Co-Design and multi-physics analysis for power electronic modules

C. Bailey^*
, H. Lu
, T. Tilford
, J. Rizvi
, C. Yin

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review

Abstract

Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for powerelectronics models.

Original language	English
Title of host publication	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
DOIs	https://doi.org/10.1109/ESIME.2009.4938505
Publication status	Published - 2009
Externally published	Yes
Event	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009

Publication series

Name	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Conference

Conference	2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	26/04/09 → 29/04/09

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

ASJC Scopus subject areas

Computational Theory and Mathematics
Control and Systems Engineering
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering

Access to Document

10.1109/ESIME.2009.4938505

Cite this

Bailey, C., Lu, H., Tilford, T., Rizvi, J., & Yin, C. (2009). Co-Design and multi-physics analysis for power electronic modules. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 Article 4938505 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). https://doi.org/10.1109/ESIME.2009.4938505

Bailey, C. ; Lu, H. ; Tilford, T. et al. / Co-Design and multi-physics analysis for power electronic modules. 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

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title = "Co-Design and multi-physics analysis for power electronic modules",

abstract = "Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics \& multi-disciplinary design for powerelectronics models.",

author = "C. Bailey and H. Lu and T. Tilford and J. Rizvi and C. Yin",

year = "2009",

doi = "10.1109/ESIME.2009.4938505",

language = "English",

isbn = "9781424441617",

series = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

booktitle = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009",

note = "2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 ; Conference date: 26-04-2009 Through 29-04-2009",

}

Bailey, C, Lu, H, Tilford, T, Rizvi, J & Yin, C 2009, Co-Design and multi-physics analysis for power electronic modules. in 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009., 4938505, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, Delft, Netherlands, 26/04/09. https://doi.org/10.1109/ESIME.2009.4938505

Co-Design and multi-physics analysis for power electronic modules. / Bailey, C.; Lu, H.; Tilford, T. et al.
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938505 (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review

TY - GEN

T1 - Co-Design and multi-physics analysis for power electronic modules

AU - Bailey, C.

AU - Lu, H.

AU - Tilford, T.

AU - Rizvi, J.

AU - Yin, C.

PY - 2009

Y1 - 2009

N2 - Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for powerelectronics models.

AB - Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for powerelectronics models.

UR - https://www.scopus.com/pages/publications/67650511903

U2 - 10.1109/ESIME.2009.4938505

DO - 10.1109/ESIME.2009.4938505

M3 - Conference proceedings published in a book

AN - SCOPUS:67650511903

SN - 9781424441617

T3 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

T2 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Y2 - 26 April 2009 through 29 April 2009

ER -

Bailey C, Lu H, Tilford T, Rizvi J, Yin C. Co-Design and multi-physics analysis for power electronic modules. In 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 2009. 4938505. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009). doi: 10.1109/ESIME.2009.4938505

Co-Design and multi-physics analysis for power electronic modules

Abstract

Publication series

Conference

UN SDGs

ASJC Scopus subject areas

Access to Document

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