TY - GEN
T1 - Co-Design and multi-physics analysis for power electronic modules
AU - Bailey, C.
AU - Lu, H.
AU - Tilford, T.
AU - Rizvi, J.
AU - Yin, C.
PY - 2009
Y1 - 2009
N2 - Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for powerelectronics models.
AB - Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that underake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods,and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for powerelectronics models.
UR - http://www.scopus.com/inward/record.url?scp=67650511903&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2009.4938505
DO - 10.1109/ESIME.2009.4938505
M3 - Conference proceedings published in a book
AN - SCOPUS:67650511903
SN - 9781424441617
T3 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
T2 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Y2 - 26 April 2009 through 29 April 2009
ER -
