Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices

C. Bailey; J. Rizvi; C. Yin; H. Lu; S. Stoyanov

doi:10.1109/POLYTR.2007.4339175

Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices

C. Bailey^*, J. Rizvi, C. Yin, H. Lu, S. Stoyanov

^*Corresponding author for this work

University of Greenwich

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review

Abstract

With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around Computational Fluid Dynamics, Finite Element Analysis and Optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.

Original language	English
Title of host publication	6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
Pages	240-244
Number of pages	5
DOIs	https://doi.org/10.1109/POLYTR.2007.4339175
Publication status	Published - 2007
Externally published	Yes
Event	Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan Duration: 15 Jan 2007 → 18 Jan 2007

Publication series

Name	6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Conference

Conference	Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Country/Territory	Japan
City	Tokyo
Period	15/01/07 → 18/01/07

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Polymers and Plastics

Keywords

Assembly
Modelling
Polymer and adhesive materials
Reliabilty

Access to Document

10.1109/POLYTR.2007.4339175

Cite this

Bailey, C., Rizvi, J., Yin, C., Lu, H., & Stoyanov, S. (2007). Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings (pp. 240-244). Article 4339175 (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings). https://doi.org/10.1109/POLYTR.2007.4339175

Bailey, C. ; Rizvi, J. ; Yin, C. et al. / Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. pp. 240-244 (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings).

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title = "Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices",

abstract = "With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around Computational Fluid Dynamics, Finite Element Analysis and Optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.",

keywords = "Assembly, Modelling, Polymer and adhesive materials, Reliabilty",

author = "C. Bailey and J. Rizvi and C. Yin and H. Lu and S. Stoyanov",

year = "2007",

doi = "10.1109/POLYTR.2007.4339175",

language = "English",

isbn = "1424411866",

series = "6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings",

pages = "240--244",

booktitle = "6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings",

note = "Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics ; Conference date: 15-01-2007 Through 18-01-2007",

}

Bailey, C, Rizvi, J, Yin, C, Lu, H & Stoyanov, S 2007, Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. in 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings., 4339175, 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings, pp. 240-244, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, Japan, 15/01/07. https://doi.org/10.1109/POLYTR.2007.4339175

Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. / Bailey, C.; Rizvi, J.; Yin, C. et al.
6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. p. 240-244 4339175 (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review

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AU - Rizvi, J.

AU - Yin, C.

AU - Lu, H.

AU - Stoyanov, S.

PY - 2007

Y1 - 2007

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AB - With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around Computational Fluid Dynamics, Finite Element Analysis and Optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.

KW - Assembly

KW - Modelling

KW - Polymer and adhesive materials

KW - Reliabilty

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U2 - 10.1109/POLYTR.2007.4339175

DO - 10.1109/POLYTR.2007.4339175

M3 - Conference proceedings published in a book

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SN - 1424411866

SN - 9781424411863

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Bailey C, Rizvi J, Yin C, Lu H, Stoyanov S. Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. 2007. p. 240-244. 4339175. (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings). doi: 10.1109/POLYTR.2007.4339175

Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices

Abstract

Publication series

Conference

ASJC Scopus subject areas

Keywords

Access to Document

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