Research output per year
Research output per year
Research output
Search results
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2016
Environmental effects on the bending fatigue of laminated composites: Experimental and modelling approaches
Meng, M., Le, H., Grove, S. & Rizvi, M., 1 Jan 2016, Host publication not specified in Elements. Vol. 0.Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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2014
Numerical studies of integrally-heated composite tooling
Abdalrahman, R., Grove, S., Kyte, A. & Rizvi, M., 1 Jan 2014, Host publication not specified in Elements. Vol. 0.Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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2009
Co-Design and multi-physics analysis for power electronic modules
Bailey, C., Lu, H., Tilford, T., Rizvi, J. & Yin, C., 2009, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 4938505. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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2008
Design for reliability for wafer level system in package
Stoyanov, S., Strusevich, N., Rizvi, J., Georgee, V., Yannou, J. M. & Bailey, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 293-298 6 p. 4684364. (Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC).Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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Impact of assembly process technologies on electronic packaging materials
Tilford, T., Bailey, C., Parrott, A. K., Rizvi, J., Yin, C., Sinclair, K. I. & Desmulliez, M. P. Y., 2008, Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008. 4607039. (Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008).Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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2007
Application of modeling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices
Bailey, C., Rizvi, J., Yin, C., Lu, H. & Stoyanov, S., 2007, 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings. p. 240-244 5 p. 4339175. (6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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Modelling the reliability of components on flexible substrates
Rizvi, J., Yin, C., Bailey, C. & Lu, H., 2007, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. p. 375-380 6 p. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; vol. 1).Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review
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Performance and reliability of flexible substrates when subjected to lead-free processing
Rizvi, M., Yin, C., Bailey, C. & Lu, H., 1 Dec 2007, Host publication not specified in Elements. Vol. 0. p. 589-594Research output: Chapter in Book/Report/Conference proceeding › Conference proceedings published in a book › peer-review